Wafer mapping systems are for real time Si wafer measurement. This system has 3 types based on the mounted stage - Rθ, XY and RθXY.
SF-3Rθ does the mapping at high speed up to 12 inch wafer.
SF-3AA and SF-300AAF are a system with a pattern matching function and X-Y positioning. The accuracy of positioning is 2μm or less.
#wafer thickness, mapping, inspection, R&D, pattern matching, X-Y positioning, measurement, determination
|Type||Rθ mapping system||high precision|
X-Y mapping system
|Integration mapping system|
|Stage type||Rθ stage||X-Y stage||RθXY stage|
|Measurement system||probe||probe||microscope head|
|Max. wafer size||up to 300mm||up to 300mm||300mm|
|Wafer angle correction function||X||O||O|
|Pattern alignment function||X||O||O|
|Wafer thickness range||SF-3 thickness sensor specification|
|Size||body||465(W) x 615(D) x 540(H)mm||570(W) x 700(D) x 680(H)mm||475(W) x 555(D) x 1,620(H)mm|
|controller||430(W) x 430(D) x 210(H)mm||500(W) x 177(D) x 273(H)mm|
Rθ stage X-Y stage
> SF-3Rθ Bonded wafer(Si / bonding / support substrate)
Si film thickness distribution(approx. 775μm) Bonding film thickness distribution(approx. 15μm)
> SF-3AA / SF-300AAF Bonded wafer(Si / bonding / support substrate)
Si film thickness distribution(approx. 25μm) Bonding film thickness distribution(approx. 25μm)