Identifying any defect or loss on a wafer immediately is a critical part of labs and manufacturers. Wafer mapping systems help Si wafer measurement in real-time and understanding the wafer characteristics at a glance by visualizing the results in a color-coded grid.
3 types of the stage - Rθ, XY and RθXY - can be mounted on this system:
SF-3Rθ performs at high speed up to 12-inch wafer. Pattern matching and X-Y motion reproducibility are possible with either SF-3AA or SF-300AAF.
|Type||Rθ mapping system||high precision|
X-Y mapping system
|Integration mapping system|
|Stage type||Rθ stage||X-Y stage||RθXY stage|
|Measurement system||probe||probe||microscope head|
|Max. wafer size||up to 300mm||up to 300mm||300mm|
|Wafer angle correction function||X||O||O|
|Pattern alignment function||X||O||O|
|Wafer thickness range||SF-3 thickness sensor specification|
|Size||body||465(W) x 615(D) x 540(H)mm||570(W) x 700(D) x 680(H)mm||475(W) x 555(D) x 1,620(H)mm|
|controller||430(W) x 430(D) x 210(H)mm||500(W) x 177(D) x 273(H)mm|
Rθ stage X-Y stage
> SF-3Rθ Bonded wafer(Si / bonding / support substrate)
Si film thickness distribution(approx. 775μm) Bonding film thickness distribution(approx. 15μm)
> SF-3AA / SF-300AAF Bonded wafer(Si / bonding / support substrate)
Bonding film thickness distribution(approx. 25μm)
6F, 41, Seongnam-daero 925beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, 13496, Republic of Korea
Copyright ⓒ 2020 Otsuka Electronics Korea | 한국오츠카전자 All rights reserved.