Si wafer thickness monitoring system

Si wafer thickness monitoring system

Products > Semiconductor evaluation > Wafer process > SF-3 series

Products > Film evaluation > Film total thickness > SF-3 series

SF-3 series

SF-3 saves time and costs for quality inspection by performing thickness inspection in real-time during the processing of semiconductors or films. Non-destructive and non-contact measurement enables multi-layer analysis without sample damage and results can be viewed at a glance using patent granted thickness measurement algorithms.

  • Non-contact, non-destructive measurement

  • Parameter setting after spectrum analysis

  • High-speed real-time monitoring during CMP, backside grinding, final polishing(TTV, GBIR)

  • Measurement over inter-layer such as protection film and window material

  • Multi-layers analysis

  • Original analytical engine(patent pending)

  • Original analytical algorithm for thickness measurement(patent granted)

  • Automatic mapping function for thickness distribution

  • Real-time measurement(max. 60,000 points per min.)

  • Load port type applicable

  • Measurement range: 20μm

Silicon meas. thickness range6 ~ 400μm10 ~ 775μm50 ~ 1,300μm
Resin meas. thickness range10 ~ 1,000μm20 ~ 1,500μm1,000 ~ 2,600μm
Minimum sampling period5kHz(200μsec.)
Repeatability**less than ± 0.01%
Measurement size***over about Φ20μm
Measurement distance50mm, 80mm, 120mm, 150mm, 200mm
Light sourcesemiconductor light source(laser class 3B product)
Analysis method****FFT analysis, optimization method
InterfaceLAN, I/O input/output terminal
Power supplyDC 24V specification(AC power supply unit sold separately)
Size123(W) x 224(D) x 128(H)mm
Optional item

*CE acquired products are SF-3/300 and SF-3/1300

**the standard relative deviation of our standard sample AirGap(approx. 300μm and about 1,000μm) at time of measurement(n=20)

***design value at time of WD 50mm probe specification

****used when measuring thinned wafers

Measurement item
  • Film thickness analysis(max. 5 layers)

  • Thickness measurement for Si wafer material

  • Air gap size

  • Grinding evaluation for silicon / compound semiconductor

  • 1.3mm / next-generation 450mm wafer

  • 775㎛ 300mm wafer

  • TSV wafer(Si layer thickness measurement on via)

  • Other materials(SiO2, film)