Load port compatible film thickness measurement

Load port compatible film thickness measurement

Products > Semiconductor evaluation > Wafer process > GS-300


Identifying any defect or loss on a wafer immediate is a critical part of labs and manufacturers. GS-300 helps Si wafer measurement in real-time and understanding the wafer characteristics at a glance by visualizing the results in a color-coded grid.

GS-300’s measurement system is compatible with load port, it is available as a spare unit of 300mm EFEM port and still adopts pattern matching and X-Y motion reproducibility of 2μm or less accuracy using RθXY stage.

  • Compatible with spare unit of 300mm EFEM port

  • Acheives pattern alignment of wiring patterns embedded in wafers

  • Responds to high throughput requirements of semiconductor process

  • Supports high precision notch alignment function
  • Minimized size allows installation in small spaces
TypeIntegration mapping system
Stage typeRθXY stage
Measurement systemmicroscope head
Max. wafer size300mm
Wafer angle correction functionO
Pattern alignment functionO
Wafer thickness rangeSF-3 thickness sensor specification
475(W) x 555(D) x 1,620(H)mm

Measurable samples(example)
  • Silicon thickness after grinding TSV embedded pattern wafer
  • 300mm thickness wafer

Measured data

> Bonded wafer(Si / bonding / support substrate)

Si film thickness distribution(approx. 25μm)                                           Bonding film thickness distribution(approx. 25μm)