Load port compatible film thickness measurement

Si wafer thickness monitoring system

Products > Semiconductor evaluation > Wafer process > GS-300

GS-300

GS-300 measures Si wafer in real time. It has pattern matching and X-Y positioning function. The accuracy of positioning is 2μm or less.


This measurement system is compatible with load port, which is also available as a spare unit of 300mm EFEM port.


#wafer thickness, mapping, inspection, R&D, pattern matching, X-Y positioning, measurement, determination

 Features  
  • Compatible with spare unit of 300mm EFEM port

  • Acheives pattern alignment of wiring patterns embedded in wafers

  • Responds to high throughput requirements of semiconductor process

  • Supports high precision notch alignment function
  • Minimized size allows installation in small spaces
 Specifications 
TypeIntegration mapping system
Stage typeRθXY stage
Measurement systemmicroscope head
Max. wafer size300mm
Wafer angle correction functionO
Pattern alignment functionO
Wafer thickness rangeSF-3 thickness sensor specification
Size
475(W) x 555(D) x 1,620(H)mm


 Measurement 
Measurable samples(example)
  • Silicon thickness after grinding TSV embedded pattern wafer
  • 300mm thickness wafer


Measured data

> Bonded wafer(Si / bonding / support substrate)

Si film thickness distribution(approx. 25μm)                                           Bonding film thickness distribution(approx. 25μm)