Identifying any defect or loss on a wafer immediate is a critical part of labs and manufacturers. GS-300 helps Si wafer measurement in real-time and understanding the wafer characteristics at a glance by visualizing the results in a color-coded grid.
GS-300’s measurement system is compatible with load port, it is available as a spare unit of 300mm EFEM port and still adopts pattern matching and X-Y motion reproducibility of 2μm or less accuracy using RθXY stage.
Compatible with spare unit of 300mm EFEM port
Acheives pattern alignment of wiring patterns embedded in wafers
Responds to high throughput requirements of semiconductor process
|Type||Integration mapping system|
|Stage type||RθXY stage|
|Measurement system||microscope head|
|Max. wafer size||300mm|
|Wafer angle correction function||O|
|Pattern alignment function||O|
|Wafer thickness range||SF-3 thickness sensor specification|
|Size||475(W) x 555(D) x 1,620(H)mm|
> Bonded wafer(Si / bonding / support substrate)
Si film thickness distribution(approx. 25μm) Bonding film thickness distribution(approx. 25μm)