GS-300 measures Si wafer in real time. It has pattern matching and X-Y positioning function. The accuracy of positioning is 2μm or less.
This measurement system is compatible with load port, which is also available as a spare unit of 300mm EFEM port.
#wafer thickness, mapping, inspection, R&D, pattern matching, X-Y positioning, measurement, determination
Compatible with spare unit of 300mm EFEM port
Acheives pattern alignment of wiring patterns embedded in wafers
Responds to high throughput requirements of semiconductor process
|Type||Integration mapping system|
|Stage type||RθXY stage|
|Measurement system||microscope head|
|Max. wafer size||300mm|
|Wafer angle correction function||O|
|Pattern alignment function||O|
|Wafer thickness range||SF-3 thickness sensor specification|
|Size||475(W) x 555(D) x 1,620(H)mm|
> Bonded wafer(Si / bonding / support substrate)
Si film thickness distribution(approx. 25μm) Bonding film thickness distribution(approx. 25μm)