Evaluating transparent foreign substances and defects in the nano-order.
Obtaining instant depth direction information in single shot.
High-speed measurement without focus.
Non-destructive, non-contact and non-invasive measurement.
Easy to find the required location by scanning rough position around the target at high-speed, without focus.
Real-time measurement of Si wafer thickness at CMP or backside grinding
Non-contact and non-destructive measurement available
Original analytical algorithm for thickness measurement (patent granted)
Inspects thickness unevenness of film using hyperspectral imaging without any drop out
Originally designed hardware(hyperspectral camera) and software
High precision measurement(patented)
Wide sample inspection at one time
Inspects thickness unevenness of film and other materials using hyperspectral imaging
Originally designed hardware(hyperspectral camera) and software
High precision measurement(patented)
Multipurpose spectrometer covering from UV to NIR wavelength range
Able to measure micro spot spectrum, light source, transmittance, reflectance, object color and thickness
Compact size and light weight - 60% of downsizing from previous generation
Suitable for low retardation measurement
High speed measurement of retardation simultaneously with optical axis detection - the world's fastest equivalent
Lineup includes various wavelengths in addition to 550nm
Multipurpose spectrometer covering from UV to NIR wavelength range
Able to measure micro spot spectrum, light source, transmittance, reflectance, object color and thickness
Compact size and light weight - 60% of downsizing from previous generation
6F, 41, Seongnam-daero 925beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, 13496, Republic of Korea
Copyright ⓒ 2020 Otsuka Electronics Korea | 한국오츠카전자 All rights reserved.